IC 8051 MCU 64K FLASH 64TQFP

C8051F021-GQ

Manufacturer Part NumberC8051F021-GQ
DescriptionIC 8051 MCU 64K FLASH 64TQFP
ManufacturerSilicon Laboratories Inc
SeriesC8051F02x
C8051F021-GQ datasheets
 

Specifications of C8051F021-GQ

Program Memory TypeFLASHProgram Memory Size64KB (64K x 8)
Package / Case64-TQFP, 64-VQFPCore Processor8051
Core Size8-BitSpeed25MHz
ConnectivityEBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USARTPeripheralsBrown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o32Ram Size4.25K x 8
Voltage - Supply (vcc/vdd)2.7 V ~ 3.6 VData ConvertersA/D 8x8b, 8x12b; D/A 2x12b
Oscillator TypeInternalOperating Temperature-40°C ~ 85°C
Processor SeriesC8051F0xCore8051
Data Bus Width8 bitData Ram Size4.25 KB
Interface TypeI2C/SMBus/SPI/UARTMaximum Clock Frequency25 MHz
Number Of Programmable I/os32Number Of Timers4
Operating Supply Voltage2.7 V to 3.6 VMaximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT3rd Party Development ToolsPK51, CA51, A51, ULINK2
Development Tools By SupplierC8051F020DKMinimum Operating Temperature- 40 C
On-chip Adc8-ch x 8-bit or 8-ch x 12-bitOn-chip Dac2-ch x 12-bit
No. Of I/o's32Ram Memory Size4352Byte
Cpu Speed25MHzNo. Of Timers5
No. Of Pwm Channels5Rohs CompliantYes
Data Rom Size64 KBA/d Bit Size12 bit
A/d Channels Available8Height1.05 mm
Length10 mmSupply Voltage (max)3.6 V
Supply Voltage (min)2.7 VWidth10 mm
Lead Free Status / RoHS StatusLead free / RoHS CompliantFor Use With336-1200 - DEV KIT FOR F020/F021/F022/F023
Eeprom Size-Other names336-1201
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C8051F020/1/2/3
16.4. Multiplexed and Non-multiplexed Selection
The External Memory Interface is capable of acting in a Multiplexed mode or a Non-multiplexed mode, depending
on the state of the EMD2 (EMI0CF.4) bit.
16.4.1. Multiplexed Configuration
In Multiplexed mode, the Data Bus and the lower 8-bits of the Address Bus share the same Port pins: AD[7:0]. In this
mode, an external latch (74HC373 or equivalent logic gate) is used to hold the lower 8-bits of the RAM address. The
external latch is controlled by the ALE (Address Latch Enable) signal, which is driven by the External Memory Inter-
face logic. An example of a Multiplexed Configuration is shown in Figure 16.3.
In Multiplexed mode, the external MOVX operation can be broken into two phases delineated by the state of the ALE
signal. During the first phase, ALE is high and the lower 8-bits of the Address Bus are presented to AD[7:0]. During
this phase, the address latch is configured such that the ‘Q’ outputs reflect the states of the ‘D’ inputs. When ALE
falls, signaling the beginning of the second phase, the address latch outputs remain fixed and are no longer dependent
on the latch inputs. Later in the second phase, the Data Bus controls the state of the AD[7:0] port at the time /RD or
/WR is asserted.
See
Section “16.6.2. Multiplexed Mode” on page 156
Figure 16.3. Multiplexed Configuration Example
A[15:8]
ALE
E
AD[7:0]
ADDRESS/DATA BUS
M
I
F
/WR
/RD
148
for more information.
ADDRESS BUS
74HC373
G
D
Q
V
DD
8
Rev. 1.4
A[15:8]
A[7:0]
64K X 8
SRAM
I/O[7:0]
CE
WE
OE