IC 8051 MCU 64K FLASH 64TQFP

C8051F021-GQ

Manufacturer Part NumberC8051F021-GQ
DescriptionIC 8051 MCU 64K FLASH 64TQFP
ManufacturerSilicon Laboratories Inc
SeriesC8051F02x
C8051F021-GQ datasheets
 


Specifications of C8051F021-GQ

Program Memory TypeFLASHProgram Memory Size64KB (64K x 8)
Package / Case64-TQFP, 64-VQFPCore Processor8051
Core Size8-BitSpeed25MHz
ConnectivityEBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USARTPeripheralsBrown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o32Ram Size4.25K x 8
Voltage - Supply (vcc/vdd)2.7 V ~ 3.6 VData ConvertersA/D 8x8b, 8x12b; D/A 2x12b
Oscillator TypeInternalOperating Temperature-40°C ~ 85°C
Processor SeriesC8051F0xCore8051
Data Bus Width8 bitData Ram Size4.25 KB
Interface TypeI2C/SMBus/SPI/UARTMaximum Clock Frequency25 MHz
Number Of Programmable I/os32Number Of Timers4
Operating Supply Voltage2.7 V to 3.6 VMaximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT3rd Party Development ToolsPK51, CA51, A51, ULINK2
Development Tools By SupplierC8051F020DKMinimum Operating Temperature- 40 C
On-chip Adc8-ch x 8-bit or 8-ch x 12-bitOn-chip Dac2-ch x 12-bit
No. Of I/o's32Ram Memory Size4352Byte
Cpu Speed25MHzNo. Of Timers5
No. Of Pwm Channels5Rohs CompliantYes
Data Rom Size64 KBA/d Bit Size12 bit
A/d Channels Available8Height1.05 mm
Length10 mmSupply Voltage (max)3.6 V
Supply Voltage (min)2.7 VWidth10 mm
Lead Free Status / RoHS StatusLead free / RoHS CompliantFor Use With336-1200 - DEV KIT FOR F020/F021/F022/F023
Eeprom Size-Other names336-1201
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Page 166/272

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C8051F020/1/2/3
17.1.7. External Memory Interface Pin Assignments
If the External Memory Interface (EMIF) is enabled on the Low ports (Ports 0 through 3), EMIFLE (XBR2.1) should
be set to a logic 1 so that the Crossbar will not assign peripherals to P0.7 (/WR), P0.6 (/RD), and if the External Mem-
ory Interface is in Multiplexed mode, P0.5 (ALE). Figure 17.4 shows an example Crossbar Decode Table with
EMIFLE=1 and the EMIF in Multiplexed mode. Figure 17.5 shows an example Crossbar Decode Table with
EMIFLE=1 and the EMIF in Non-multiplexed mode.
If the External Memory Interface is enabled on the Low ports and an off-chip MOVX operation occurs, the External
Memory Interface will control the output states of the affected Port pins during the execution phase of the MOVX
instruction, regardless of the settings of the Crossbar registers or the Port Data registers. The output configuration of
the Port pins is not affected by the EMIF operation, except that Read operations will explicitly disable the output
drivers on the Data Bus. See
Section “16. EXTERNAL DATA MEMORY INTERFACE AND ON-CHIP
XRAM” on page 145
for more information about the External Memory Interface.
Figure 17.4. Priority Crossbar Decode Table
EMIFLE = 1; EMIF in Multiplexed Mode; P1MDIN = 0xFF)
P0
PIN I/O 0
1
2
3
4
5
6
7
0
1
2
TX0
RX0
SCK
MISO
MOSI
NSS
SDA
SCL
TX1
  
RX1
CEX0
    
CEX1
CEX2
     
CEX3
CEX4
    
       
ECI
    
       
CP0
    
       
CP1
    
       
T0
    
       
/INT0
    
       
T1
    
       
/INT1
    
       
T2
    
       
T2EX
    
       
T4
    
       
T4EX
    
       
/SYSCLK
    
       
CNVSTR
AIN1 Inputs/Non-muxed Addr H Muxed Addr H/Non-muxed Addr L
166
P1
P2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
  
    
    
 
  
   
    
     
      
       
        
         
          
           
            
             
              
Muxed Data/Non-muxed Data
Rev. 1.4
P3
Crossbar Register Bits
1
2
3
4
5
6
7
UART0EN:
XBR0.2
SPI0EN:
XBR0.1
SMB0EN:
XBR0.0
UART1EN:
XBR2.2
PCA0ME:
XBR0.[5:3]
ECI0E: XBR0.6
CP0E: XBR0.7
CP1E: XBR1.0
T0E: XBR1.1
INT0E: XBR1.2
T1E: XBR1.3
INT1E: XBR1.4
T2E: XBR1.5
T2EXE: XBR1.6
T4E: XBR2.3
T4EXE: XBR2.4
SYSCKE: XBR1.7
CNVSTE: XBR2.0