MC68HC711E9CFNE2 Freescale Semiconductor, MC68HC711E9CFNE2 Datasheet - Page 25

IC MCU 8BIT 512RAM 52-PLC

MC68HC711E9CFNE2

Manufacturer Part Number
MC68HC711E9CFNE2
Description
IC MCU 8BIT 512RAM 52-PLC
Manufacturer
Freescale Semiconductor
Series
HC11r
Datasheet

Specifications of MC68HC711E9CFNE2

Core Processor
HC11
Core Size
8-Bit
Speed
2MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
38
Program Memory Size
12KB (12K x 8)
Program Memory Type
OTP
Eeprom Size
512 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
52-PLCC
Processor Series
HC711E
Core
HC11
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SCI, SPI
Maximum Clock Frequency
2 MHz
Number Of Programmable I/os
38
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
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Manufacturer:
TE
Quantity:
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Part Number:
MC68HC711E9CFNE2
Manufacturer:
FREESCAL
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Part Number:
MC68HC711E9CFNE2
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1.4 Structure
M68HC11E Family — Rev. 3.2
MOTOROLA
See
Differences among devices are noted in the table accompanying
Figure
Figure 1-1
Several packaging options:
– 52-pin plastic-leaded chip carrier (PLCC)
– 52-pin windowed ceramic leaded chip carrier (CLCC)
– 52-pin plastic thin quad flat pack, 10 mm x 10 mm (TQFP)
– 64-pin quad flat pack (QFP)
– 48-pin plastic dual in-line package (DIP), MC68HC811E2 only
– 56-pin plastic shrink dual in-line package, .070-inch lead
1-1.
spacing (SDIP)
General Description
for a functional diagram of the E-series MCUs.
General Description
Technical Data
Structure
25

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