EP3SE50F780I3N Altera, EP3SE50F780I3N Datasheet - Page 29

• Manufacturer Part Number: EP3SE50F780I3N
• Description: Stratix III
• Manufacturer: Altera

Altera Corporation
November 2007
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Stratix III board in a system during system operation without causing
undesirable effects to the running system bus or the board that was
inserted into the system.
The hot-socketing feature also makes it easier to use Stratix III devices on
printed circuit boards (PCBs) that also contain a mixture of 3.3-V, 3.0-V,
2.5-V, 1.8-V, 1.5-V and 1.2-V devices. With the Stratix III hot socketing
feature, you no longer need to ensure a proper power-up sequence for
each device on the board.
For more information, refer to the
Stratix III
Configuration
Stratix III devices are configured using one of the following four
configuration schemes:
■
■
■
■
All configuration schemes use either an external controller (for example,
a MAX
download cable.
Stratix III devices support configuration data decompression, which
saves configuration memory space and time. This feature allows you to
store compressed configuration data in configuration devices or other
memory and transmit this compressed bitstream to Stratix III devices.
During configuration, the Stratix III device decompresses the bitstream in
real time and programs its SRAM cells.
Stratix III devices support decompression in the FPP when using a
MAX II device/microprocessor + flash, fast AS, and PS configuration
schemes. The Stratix III decompression feature is not available in the FPP
when using the enhanced configuration device and JTAG configuration
schemes.
For more information, refer to the
in volume 1 of the Stratix III Device Handbook.
Fast passive parallel (FPP)
Fast active serial (AS)
Passive serial (PS)
Joint Test Action Group (JTAG)
®
II device or microprocessor), a configuration device, or a
Devices chapter in volume 1 of the Stratix III Device Handbook.
Hot Socketing and Power-On Reset in
Configuring Stratix III Devices
Stratix III Device Handbook, Volume 1
Stratix III Device Family Overview
chapter
1–11