MC8640DTHX1067NE Freescale Semiconductor, MC8640DTHX1067NE Datasheet - Page 108

• Manufacturer Part Number: MC8640DTHX1067NE
• Description: IC MPU DUAL CORE E600 1023FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC8640DTHX1067NE

• Processor Type: MPC86xx PowerPC 32-Bit
• Speed: 1.067GHz
• Voltage: 0.95V
• Mounting Type: Surface Mount
• Package / Case: 1023-FCCBGA
• Processor Series: MPC8xxx
• Core: e600
• Development Tools By Supplier: MCEVALHPCN-8641D
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: No

Thermal
19.1
Table 71
19.2 Thermal Management Information
This section provides thermal management information for the high coefficient of thermal expansion
(HCTE) package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The MPC8640 implements
several features designed to assist with thermal management, including the temperature diode. The
temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see
information.
To reduce the die-junction temperature, heat sinks are required. Due to the potential large mass of the heat
sink, attachment through the printed-circuit board is suggested. In any implementation of a heat sink
solution, the force on the die should not exceed ten pounds force (45 newtons).
108
Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board
Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board
Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board
Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board
Junction-to-board thermal resistance
Junction-to-case thermal resistance
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
5. This is the thermal resistance between die and case top surface as measured by the cold plate method (MIL SPEC-883
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
Method 1012.1) with the calculated case temperature. Actual thermal resistance is less than 0.1 °C/W.
provides the package thermal characteristics for the MPC8640.
Thermal Characteristics
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
Characteristic
Table 71. Package Thermal Characteristics
Section 19.2.4, “Temperature Diode,”
1
Symbol
R
R
R
R
R
R
θ
θ
θ
θ
θ
θ
JMA
JMA
JC
JA
JA
JB
Figure 59
Value
< 0.1
Freescale Semiconductor
18
13
13
9
5
for more
shows a spring
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
1, 2
1, 3
1, 3
1, 3
4
5