MC8640DTHX1067NE Freescale Semiconductor, MC8640DTHX1067NE Datasheet - Page 87

• Manufacturer Part Number: MC8640DTHX1067NE
• Description: IC MPU DUAL CORE E600 1023FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC8640DTHX1067NE

• Processor Type: MPC86xx PowerPC 32-Bit
• Speed: 1.067GHz
• Voltage: 0.95V
• Mounting Type: Surface Mount
• Package / Case: 1023-FCCBGA
• Processor Series: MPC8xxx
• Core: e600
• Development Tools By Supplier: MCEVALHPCN-8641D
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: No

Random jitter is calibrated using a high pass filter with a low frequency corner at 20 MHz and a 20
dB/decade roll-off below this. The required sinusoidal jitter specified in
Specifications,”
16 Package
This section details package parameters and dimensions.
16.1
The package parameters are as provided in the following list. The package type is 33 mm × 33 mm, 1023
pins. There are two package options: high-lead flip chip-ceramic ball grid array (FC-CBGA) and lead-free
(FC-CBGA).
Freescale Semiconductor
For all package types:
Die size
Package outline
Interconnects
Pitch
Total Capacitor count
For high-lead FC-CBGA (package option: HCTE
Maximum module height
Minimum module height
Solder Balls
Ball diameter (typical
For RoHS lead-free FC-CBGA (package option: HCTE
Maximum module height
Minimum module height
Solder Balls
Ball diameter (typical
1
2
High-coefficient of thermal expansion
Typical ball diameter is before reflow
Package Parameters for the MPC8640
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
is then added to the signal and the test load is replaced by the receiver being tested.
2
2
)
)
1 mm
43 caps; 100 nF each
2.97 mm
2.47 mm
89.5% Pb 10.5% Sn
0.60 mm
2.77 mm
2.27 mm
95.5% Sn 4.0% Ag 0.5% Cu
0.60 mm
12.1 mm × 14.7 mm
33 mm × 33 mm
1023
1
HX)
1
VU)
Section 15.7, “Receiver
Package
87