MC8640DTHX1067NE Freescale Semiconductor, MC8640DTHX1067NE Datasheet - Page 112

• Manufacturer Part Number: MC8640DTHX1067NE
• Description: IC MPU DUAL CORE E600 1023FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC8640DTHX1067NE

• Processor Type: MPC86xx PowerPC 32-Bit
• Speed: 1.067GHz
• Voltage: 0.95V
• Mounting Type: Surface Mount
• Package / Case: 1023-FCCBGA
• Processor Series: MPC8xxx
• Core: e600
• Development Tools By Supplier: MCEVALHPCN-8641D
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: No

Thermal
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity and mechanical strength to meet equipment shock/vibration
requirements. There are several commercially available thermal interfaces and adhesive materials
provided by the following vendors:
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
19.2.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
where:
112
The Bergquist Company
18930 West 78
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
Corporate Center
PO Box 994
Midland, MI 48686-0994
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
T
T
T
R
R
R
P
i
r
d
j
θJC
θint
θsa
is the die-junction temperature
is the inlet cabinet ambient temperature
is the air temperature rise within the computer cabinet
is the power dissipated by the device
is the heat sink base-to-ambient thermal resistance
is the junction-to-case thermal resistance
is the adhesive or interface material thermal resistance
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
T
j
= T
i
th
+ T
St.
r
+ (R
θJC
+ R
θint
+ R
θsa
) × P
d
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