MC8640DTHX1067NE Freescale Semiconductor, MC8640DTHX1067NE Datasheet - Page 121

• Manufacturer Part Number: MC8640DTHX1067NE
• Description: IC MPU DUAL CORE E600 1023FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC8640DTHX1067NE

• Processor Type: MPC86xx PowerPC 32-Bit
• Speed: 1.067GHz
• Voltage: 0.95V
• Mounting Type: Surface Mount
• Package / Case: 1023-FCCBGA
• Processor Series: MPC8xxx
• Core: e600
• Development Tools By Supplier: MCEVALHPCN-8641D
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: No

SENSEV
Likewise, AV
The mechanical drawing for the single core device is located in
the MPC8640
For other pin pull-up or pull-down recommendations of signals, please see
20.7
The MPC8640 drivers are characterized over process, voltage, and temperature. For all buses, the driver
is a push-pull single-ended driver type (open drain for I
To measure Z
or GND. Then, the value of each resistor is varied until the pad voltage is OV
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and R
OV
other in value. Then, Z
Table 73
nominal OV
Freescale Semiconductor
DD
/2. R
summarizes the signal impedance targets. The driver impedances are targeted at minimum V
SS
Output Buffer DC Impedance
P
_Core1 and needs to be connected to ground with a weak (2–10 k
DD
Note: Nominal supply voltages. See
then becomes the resistance of the pull-up devices. R
DD
0
FC-CBGA.”
Impedance
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
for the single-ended drivers, an external resistor is connected from the chip pad to OV
, 105 °C.
_Core1 needs to be pulled to ground as shown in
R
R
N
P
0
= (R
P
Configuration, Power
+ R
Figure 66. Driver Impedance Measurement
DUART, Control,
Data
Management
N
Table 73. Impedance Characteristics
43 Target
43 Target
) ÷ 2.
Table
1, T
j
= 105 °C.
25 Target
25 Target
Express
2
PCI
C).
Pad
P
R
R
is trimmed until the voltage at the pad equals
OV
OGND
N
P
Section 16.2, “Mechanical Dimensions of
DD
DDR DRAM
P
20 Target
20 Target
Figure
and R
SW2
SW1
N
64.
are designed to be close to each
Section 17, “Signal
Symbol
Ω)
DD
Z
Z
pull down resistor.
/2 (see
0
0
System Design Information
Unit
Figure
W
W
66). The
Listings.”
DD
DD
121
,