MC8640DTHX1067NE Freescale Semiconductor, MC8640DTHX1067NE Datasheet - Page 110

• Manufacturer Part Number: MC8640DTHX1067NE
• Description: IC MPU DUAL CORE E600 1023FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC8640DTHX1067NE

• Processor Type: MPC86xx PowerPC 32-Bit
• Speed: 1.067GHz
• Voltage: 0.95V
• Mounting Type: Surface Mount
• Package / Case: 1023-FCCBGA
• Processor Series: MPC8xxx
• Core: e600
• Development Tools By Supplier: MCEVALHPCN-8641D
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: No

Thermal
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
19.2.1
For the exposed-die packaging technology described in
resistance paths are as follows:
Figure 60
printed-circuit board.
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Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
The die junction-to-case thermal resistance (the case is actually the top of the exposed silicon die)
The die junction-to-board thermal resistance
depicts the primary heat transfer path for a package with an attached heat sink mounted to a
Internal Package Conduction Resistance
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
(Note the internal versus external package resistance.)
Figure 60. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
External Resistance
External Resistance
Internal Resistance
Printed-Circuit Board
Heat Sink
Radiation
Radiation
Table
Convection
Convection
408-436-8770
800-522-6752
603-635-5102
71, the intrinsic conduction thermal
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Freescale Semiconductor