MPC8572DS Freescale Semiconductor, MPC8572DS Datasheet - Page 121

• Manufacturer Part Number: MPC8572DS
• Description: KIT MPU POWERQUICC III
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC III™r
• Type: MPUr

Specifications of MPC8572DS

• Contents: Board
• Data Rate: 10 Mbps to 100 Mbps
• Memory Type: Flash, DDR, DDR2, DDR3, SDRAM
• Interface Type: I2C, Ethernet
• Operating Voltage: 3.3 V
• Data Bus Width: 32 bit
• Product: Development Tools
• Silicon Manufacturer: Freescale
• Core Architecture: Power Architecture
• Core Sub-architecture: PowerQUICC
• Silicon Core Number: MPC85xx
• Silicon Family Name: PowerQUICC III
• Rohs Compliant: Yes
• For Use With/related Products: MPC8572E
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

19.5.2
Section 4.4.3.6, “I/O Port Selection,” in the MPC8572E PowerQUICC III Integrated Host Processor
Family Reference Manual describes various high-speed interface configuration options. Note that the CCB
clock frequency must be considered for proper operation of such interfaces as described below.
For proper PCI Express operation, the CCB clock frequency must be greater than or equal to:
See Section 21.1.3.2, “Link Width,” in the MPC8572E PowerQUICC III Integrated Host Processor
Family Reference Manual for PCI Express interface width details. Note that the “PCI Express link width”
in the above equation refers to the negotiated link width as the result of PCI Express link training, which
may or may not be the same as the link width POR selection.
For proper serial RapidIO operation, the CCB clock frequency must be greater than:
See Section 20.4, “1x/4x LP-Serial Signal Descriptions,” in the MPC8572E PowerQUICC III Integrated
Host Processor Family Reference Manual for Serial RapidIO interface width and frequency details.
20 Thermal
This section describes the thermal specifications of the MPC8572E.
Table 84
The package uses a 29.6 × 29.6 mm lid that attaches to the substrate. Recommended maximum heat sink
force is 10 pounds force (45 Newton).
Freescale Semiconductor
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (at 200 ft./min.)
Junction to ambient (ar 200 ft./min.)
Junction to board
shows the thermal characteristics for the package, 1023 33 × 33 FC-PBGA.
Minimum Platform Frequency Requirements for High-Speed
Interfaces
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Rating
2
-----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
×
(
0.80
)
×
(
Table 84. Package Thermal Characteristics
serial RapidIO interface frequency
527 MHz
----------------------------------------------------------------------------------------------
×
(
PCI Express link width
Four-layer (2s2p)
Four-layer (2s2p)
Single-layer (1s)
Single-layer (1s)
64
8
Board
—
)
×
(
serial RapidIO link width
)
Symbol
R
R
R
R
R
ΘJMA
ΘJMA
ΘJA
ΘJA
ΘJB
Value
15
11
11
8
4
)
°
°
°
°
°
Unit
C/W
C/W
C/W
C/W
C/W
Notes
1, 2
1, 3
1, 3
1, 3
Thermal
4
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