MPC8572DS Freescale Semiconductor, MPC8572DS Datasheet - Page 99

• Manufacturer Part Number: MPC8572DS
• Description: KIT MPU POWERQUICC III
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC III™r
• Type: MPUr

Specifications of MPC8572DS

• Contents: Board
• Data Rate: 10 Mbps to 100 Mbps
• Memory Type: Flash, DDR, DDR2, DDR3, SDRAM
• Interface Type: I2C, Ethernet
• Operating Voltage: 3.3 V
• Data Bus Width: 32 bit
• Product: Development Tools
• Silicon Manufacturer: Freescale
• Core Architecture: Power Architecture
• Core Sub-architecture: PowerQUICC
• Silicon Core Number: MPC85xx
• Silicon Family Name: PowerQUICC III
• Rohs Compliant: Yes
• For Use With/related Products: MPC8572E
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

18 Package Description
This section describes package parameters, pin assignments, and dimensions.
18.1
The package parameters are as provided in the following list. The package type is 33 mm × 33 mm, 1023
flip chip plastic ball grid array (FC-PBGA).
Freescale Semiconductor
Package outline
Interconnects
Ball Pitch
Ball Diameter (Typical)
Solder Balls
Solder Balls (Lead-Free)
Package Parameters for the MPC8572E FC-PBGA
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
1023
1 mm
0.6 mm
63% Sn
37% Pb
96.5% Sn
33 mm × 33 mm
3.5% Ag
Package Description
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