HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 150

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 6 Bus Controller
6.1.2
Figure 6.1 shows a block diagram of the bus controller.
Rev. 2.00 Sep 20, 2005 page 110 of 800
REJ09B0260-0200
Legend:
ABWCR:
ASTCR:
WCRH:
WCRL:
BRCR:
CSCR:
ADRCR:
BCR:
Internal address bus
CPU bus request signal
CPU bus acknowledge signal
Block Diagram
WAIT
Bus width control register
Access state control register
Wait control register H
Wait control register L
Bus release control register
Chip select control register
Address control register
Bus control register
Internal signals
decoder
Area
Figure 6.1 Block Diagram of Bus Controller
control signals
Chip select
CS
0
to CS
7
Bus control
Wait state
controller
Bus arbiter
circuit
ABWCR
ADRCR
ASTCR
WCRH
WCRL
CSCR
BRCR
BCR
BACK
BREQ
Bus mode control signal
Bus size control signal
Access state control signal
Wait request signal
Internal signals

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