HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 676

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 21 Electrical Characteristics
Rev. 2.00 Sep 20, 2005 page 636 of 800
REJ09B0260-0200
A
CS
BREQ
BACK
A
AS, RD,
HWR, LWR
AS
RD (read)
D
(read)
HWR, LWR
(write)
D
(write)
WAIT
23
23
15
15
n
to A
to D
to D
to A
0
0
0
0
,
,
Figure 21.13 Basic Bus Cycle: Three-State Access with One Wait State
t
BRQS
T
1
Figure 21.14 Bus-Release Mode Timing
t
WTS
T
t
2
WTH
t
BACD1
t
BZD
t
WTS
T
t
BRQS
W
t
WTH
T
3
t
t
BACD2
BZD