HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 631

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

20.1
The H8/3024 Group has a power-down state that greatly reduces power consumption by halting
the CPU, and a module standby function that reduces power consumption by selectively halting
on-chip modules.
The power-down state includes the following three modes:
The module standby function can halt on-chip supporting modules independently of the power-
down state. The modules that can be halted are the 16-bit timer, 8-bit timer, SCI0, SCI1, and A/D
converter.
Table 20.1 indicates the methods of entering and exiting the power-down modes and module
standby mode, and gives the status of the CPU and on-chip supporting modules in each mode.
Sleep mode
Software standby mode
Hardware standby mode
Overview
Section 20 Power-Down State
Rev. 2.00 Sep 20, 2005 page 591 of 800
Section 20 Power-Down State
REJ09B0260-0200