HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 376
HD64F3026X25
Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.DF3026XBL25V.pdf
(843 pages)
Specifications of HD64F3026X25
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Part Number:
HD64F3026X25
Manufacturer:
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Section 10 Programmable Timing Pattern Controller (TPC)
Therefore, 0 data can be transferred ahead of 1 data by making compare match B occur before
compare match A. NDR contents should not be altered during the interval from compare match B
to compare match A (the non-overlap margin).
This can be accomplished by having the IMFA interrupt service routine write the next data in
NDR. The next data must be written before the next compare match B occurs.
Figure 10.10 shows the timing relationships.
Rev. 2.00 Sep 20, 2005 page 336 of 800
REJ09B0260-0200
Compare
match A
Compare
match B
NDR
DR
Figure 10.10 Non-Overlapping Operation and NDR Write Timing
0 output
Do not write
to NDR in this
interval
0/1 output
Write to NDR
in this interval
NDR write
0 output
Do not write
to NDR in this
interval
Write to NDR
in this interval
NDR write
0/1 output
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