HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 683

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

2. Arithmetic instructions
Mnemonic
PUSH.W Rn
PUSH.L ERn
MOVFPE @aa:16,
Rd
MOVTPE Rs,
@aa:16
Mnemonic
ADD.B #xx:8, Rd
ADD.B Rs, Rd
ADD.W #xx:16, Rd
ADD.W Rs, Rd
ADD.L #xx:32, ERd
ADD.L ERs, ERd
ADDX.B #xx:8, Rd
ADDX.B Rs, Rd
ADDS.L #1, ERd
ADDS.L #2, ERd
ADDS.L #4, ERd
INC.B Rd
INC.W #1, Rd
INC.W #2, Rd
W
W
W
W
W
B
B
B
B
B
B
B
L
L
L
L
L
L
2
4
6
2
Instruction Length (bytes)
Instruction Length (bytes)
2
2
2
2
2
2
2
2
2
2
Addressing Mode and
Addressing Mode and
4
4
2
4
Operation
SP–2
Rn16
SP–4
ERn32
Cannot be used in the
H8/3024 Group
Cannot be used in the
H8/3024 Group
Operation
Rd8+#xx:8
Rd8+Rs8
Rd16+#xx:16
Rd16+Rs16
ERd32+#xx:32
ERd32
ERd32+ERs32
ERd32
Rd8+#xx:8 +C
Rd8+Rs8 +C
ERd32+1
ERd32+2
ERd32+4
Rd8+1
Rd16+1
Rd16+2
@SP
SP
SP
Rev. 2.00 Sep 20, 2005 page 643 of 800
Rd8
@SP
Rd16
Rd16
Rd8
ERd32
ERd32
ERd32
Rd8
Rd16
Rd8
Rd16
Rd8
Cannot be used in the
H8/3024 Group
Cannot be used in the
H8/3024 Group
— —
— —
—
—
— (1)
— (1)
— (2)
— (2)
—
—
— — — — — —
— — — — — —
— — — — — —
— —
— —
— —
I
I
Appendix A Instruction Set
Condition Code
Condition Code
H N Z
H N Z
(3)
(3)
REJ09B0260-0200
V C
0 —
0 —
V C
—
—
—
States *
States *
No. of
No. of
10
6
2
2
4
2
6
2
2
2
2
2
2
2
2
2
1
1