HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 673

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

21.3.3
Bus timing is shown as follows:
NMI
IRQ
IRQ
Basic bus cycle: two-state access
Figure 21.11 shows the timing of the external two-state access cycle.
Basic bus cycle: three-state access
Figure 21.12 shows the timing of the external three-state access cycle.
Basic bus cycle: three-state access with one wait state
Figure 21.13 shows the timing of the external three-state access cycle with one wait state
inserted.
Bus-release mode timing
Figure 21.14 shows the bus-release mode timing.
E
L
IRQ : Edge-sensitive IRQ
IRQ
(j = 0 to 5)
NMI
IRQ
Bus Timing
E
L
: Level-sensitive IRQ (i = 0 to 5)
j
Figure 21.10 Interrupt Input Timing
i
i
t
t
t
NMIS
NMIS
NMIS
t
t
t
NMIH
NMIH
NMIW
Rev. 2.00 Sep 20, 2005 page 633 of 800
Section 21 Electrical Characteristics
REJ09B0260-0200