HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 456
HD64F3026X25
Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.DF3026XBL25V.pdf
(843 pages)
Specifications of HD64F3026X25
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 456 of 843
- Download datasheet (5Mb)
Section 13 Smart Card Interface
13.1.2
Figure 13.1 shows a block diagram of the smart card interface.
Rev. 2.00 Sep 20, 2005 page 416 of 800
REJ09B0260-0200
RxD
TxD
SCK
Legend
SCMR: Smart card mode register
RSR:
RDR:
TSR:
TDR:
SMR:
SCR:
SSR:
BRR:
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register
Serial status register
Bit rate register
Block Diagram
RDR
RSR
Figure 13.1 Block Diagram of Smart Card Interface
Parity generation
Parity check
TDR
TSR
Module data bus
Transmission/
reception
control
SCMR
SMR
SSR
SCR
External clock
Clock
Baud rate
generator
BRR
TXI
RXI
ERI
/4
/16
/64
Internal
data bus
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