HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 627
HD64F3026X25
Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.DF3026XBL25V.pdf
(843 pages)
Specifications of HD64F3026X25
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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19.3
When the oscillator frequency is 5 MHz or higher, the duty adjustment circuit adjusts the duty
cycle of the clock signal from the oscillator to generate .
19.4
The prescalers divide the system clock ( ) to generate internal clocks ( /2 to /4096).
V
STBY
EXTAL
external)
RES
CC
(internal or
EXTAL
Duty Adjustment Circuit
Prescalers
V
IH
Figure 19.7 External Clock Output Settling Delay Timing
Figure 19.6 External Clock Input Timing
t
EXr
t
EXH
t
DEXT
V
0.3 V
CC
t
EXf
Rev. 2.00 Sep 20, 2005 page 587 of 800
0.7
Section 19 Clock Pulse Generator
t
EXL
REJ09B0260-0200
V
CC
0.5
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