HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 643
HD64F3026X25
Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.DF3026XBL25V.pdf
(843 pages)
Specifications of HD64F3026X25
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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20.5.3
Figure 20.2 shows the timing relationships for hardware standby mode. To enter hardware standby
mode, first drive
S T B Y
Clock
oscillator
RES
STBY
high, wait for the clock to settle, then bring
Timing for Hardware Standby Mode
R E S
low, then drive
Figure 20.2 Hardware Standby Mode Timing
S T B Y
low. To exit hardware standby mode, first drive
R E S
from low to high.
Rev. 2.00 Sep 20, 2005 page 603 of 800
Section 20 Power-Down State
Oscillator
settling time
REJ09B0260-0200
Reset
exception
handling
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