HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 514
HD64F3026X25
Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.DF3026XBL25V.pdf
(843 pages)
Specifications of HD64F3026X25
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 514 of 843
- Download datasheet (5Mb)
Section 16 RAM
16.3
Operation
When the RAME bit is set to 1, the on-chip RAM is enabled. Accesses to the addresses shown in
table 16.1 are directed to the on-chip RAM. In modes 1 to 5 (expanded modes), when the RAME
bit is cleared to 0, the off-chip address space is accessed. In mode 6, 7 (single-chip mode), when
the RAME bit is cleared to 0, the on-chip RAM is not accessed: read access always results in H'FF
data, and write access is ignored.
Since the on-chip RAM is connected to the CPU by an internal 16-bit data bus, it can be written
and read by word access. It can also be written and read by byte access. Byte data is accessed in
two states using the upper 8 bits of the data bus. Word data starting at an even address is accessed
in two states using all 16 bits of the data bus.
Rev. 2.00 Sep 20, 2005 page 474 of 800
REJ09B0260-0200
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