HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 795

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
C.2
WP2P:
RP2P:
WP2D:
WP2:
RP2:
SSOE:
n = 0 to 7
P2
n
Port 2 Block Diagram
Write to P2PCR
Read P2PCR
Write to P2DDR
Write to port 2
Read port 2
Software standby output port enable
Hardware standby
External bus
released
Software
standby
Figure C.2 Port 2 Block Diagram
Modes 6/7
Modes
1 to 5
Modes 6/7
SSOE
Modes 1 to 4
RP2P
Rev. 2.00 Sep 20, 2005 page 755 of 800
RP2
Appendix C I/O Port Block Diagrams
Q
Q
Q
P2 PCR
P2 DDR
P2 DR
WP2D
WP2P
WP2
n
n
C
C
C
n
Reset
Reset
Reset
R
R
R
D
D
D
REJ09B0260-0200

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