HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 831

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Modes 6 and 7: Figure D.4 is a timing diagram for the case in which
operation mode 6 or 7. As soon as
pin P6
7
P6
RES
Internal reset
signal
A
AS, RD
(read)
HWR, LWR
(write)
D
(write)
I/O port,
CS
/ goes to the output state at the next rise of after
P6
RES
Internal reset
signal
I/O port
23
15
7
7
7
/
/
to A
to D
to CS
0
0
1
Figure D.4 Reset during Operation (Modes 6 and 7)
Figure D.3 Reset during Memory Access (Mode 5)
R E S
Access to external
T1
goes low, all ports are initialized to the input state. Clock
memory
T2
T3
Rev. 2.00 Sep 20, 2005 page 791 of 800
R E S
goes low.
High-impedance
High-impedance
High-impedance
High-impedance
R E S
goes low during an
Appendix D Pin States
REJ09B0260-0200