HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 835

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

100
76
P-TQFP100-14x14-0.50
JEITA Package Code
e
75
1
Z
D
Index mark
*1
H
D
D
RENESAS Code
PTQP0100KA-A
y
Figure G.2 Package Dimensions (TFP-100B)
*3
b
p
51
25
TFP-100B/TFP-100BV
Previous Code
x
50
26
F
M
MASS[Typ.]
0.5g
Rev. 2.00 Sep 20, 2005 page 795 of 800
Terminal cross section
Detail F
Appendix G Package Dimensions
b
b
p
1
NOTE)
1. DIMENSIONS"*1"AND"*2"
2. DIMENSION"*3"DOES NOT
DO NOT INCLUDE MOLD FLASH
INCLUDE TRIM OFFSET.
L
1
L
REJ09B0260-0200
Reference
Symbol
D
E
A
H
H
A
A
b
b
c
c
e
x
y
Z
Z
L
L
p
1
1
1
2
D
E
1
D
E
15.8
15.8
0.00
0.17
0.12
Min
0.4
0 °
Dimension in Millimeters
Nom
1.00
16.0
16.0
0.10
0.22
0.20
0.17
0.15
1.00
1.00
14
14
0.5
0.5
1.0
0.08
0.10
Max
16.2
16.2
1.20
0.20
0.27
0.22
0.6
8 °