HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 433

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Communication Formats
Four formats are available. Parity bit settings are ignored when a multiprocessor format is
selected. For details see table 12.10.
Clock
See the description of asynchronous mode.
Transmitting and Receiving Data
Transmitting Multiprocessor Serial Data: Figure 12.10 shows a sample flowchart for
transmitting multiprocessor serial data and indicates the procedure to follow.
Figure 12.9 Example of Communication among Processors using Multiprocessor Format
Serial data
Legend
MPB: Multiprocessor bit
Transmitting
processor A
Receiving
processor
(ID = 01)
(Sending Data H'AA to Receiving Processor A)
ID-sending cycle:
receiving processor address
H'01
processor B
Receiving
(ID = 02)
(MPB = 1)
Serial communication line
Data-sending cycle:
data sent to receiving processor
specified by ID
Section 12 Serial Communication Interface
processor C
Receiving
Rev. 2.00 Sep 20, 2005 page 393 of 800
(ID = 03)
H'AA
(MPB = 0)
Receiving
processor D
(ID = 04)
REJ09B0260-0200