HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 596
HD64F3026X25
Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.DF3026XBL25V.pdf
(843 pages)
Specifications of HD64F3026X25
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 18 Flash Memory [H8/3024F-ZTAT Version]
Rev. 2.00 Sep 20, 2005 page 556 of 800
REJ09B0260-0200
FWE = 1
Notes: In order to perform a normal read of flash memory, SWE must be cleared to 0. Also note that verify-reads
Software programming
programming mode
disable state
Normal mode
On-board
can be performed during the programming/erasing process.
1.
2. Do not make a state transition by setting or clearing multiple bits simultaneously.
3. After a transition from erase mode to the erase setup state, do not enter erase mode without passing
4. After a transition from program mode to the program setup state, do not enter program mode without
through the software programming enable state.
passing through the software programming enable state.
FWE = 0
: Normal mode
*1
Figure 18.10 FLMCR1 Bit Settings and State Transitions
SWE = 0
SWE = 1
programming
*2
Software
enable
state
: On-board programming mode
ESU = 1
PV = 0
PSU = 0
EV = 1
PSU = 1
EV = 0
PV = 1
ESU = 0
Program-verify
Erase-verify
Erase setup
setup state
Program
mode
mode
state
*3
*4
E = 1
E = 0
P = 1
P = 0
Program mode
Erase mode
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