HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 711

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number

HD64F3026X25

Description

MCU 3V 256K 100-TQFP

Manufacturer

Renesas Electronics America

Series

H8® H8/300Hr

Datasheet

1.DF3026XBL25V.pdf (843 pages)

Specifications of HD64F3026X25

Core Processor

H8/300H

Core Size

16-Bit

Speed

25MHz

Connectivity

SCI, SmartCard

Peripherals

PWM, WDT

Number Of I /o

70

Program Memory Size

256KB (256K x 8)

Program Memory Type

FLASH

Ram Size

8K x 8

Voltage - Supply (vcc/vdd)

3 V ~ 3.6 V

Data Converters

A/D 8x10b; D/A 2x8b

Oscillator Type

Internal

Operating Temperature

-20°C ~ 75°C

Package / Case

100-TQFP, 100-VQFP

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Eeprom Size

-

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

BOSTOCK HK LIMITED

BOSTOCK HK LIMITED

Part Number:

HD64F3026X25

Manufacturer:

Renesas Electronics America

Quantity:

10 000

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Address

(Low)

H'EE068 —

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H'EE06D —

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H'EE070 —

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H'EE072 —

H'EE073 —

H'EE074 Reserved area (access prohibited)

H'EE075

H'EE076

H'EE077 RAMCR *

H'EE078 Reserved area (access prohibited)

H'EE079

H'EE07A

H'EE07B

H'EE07C

H'EE07D

H'EE07E

H'EE07F

H'EE080

H'EE081

H'FFF20

H'FFF21

H'FFF22

H'FFF23

H'FFF24

H'FFF25

H'FFF26

H'FFF27

H'FFF28

H'FFF29

Register

Name

5

Data

Bus

Width Bit 7

8

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Bit 4

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Bit Names

Bit 3

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RAMS

Rev. 2.00 Sep 20, 2005 page 671 of 800

Bit 2

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RAM2

Appendix B Internal I/O Registers

Bit 1

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RAM1

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RAM0

Bit 0

REJ09B0260-0200

Module Name

Flash memory

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