HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 174

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 6 Bus Controller
6.4.5
8-Bit, Three-State-Access Areas: Figure 6.8 shows the timing of bus control signals for an 8-bit,
three-state-access area. The upper data bus (D
L W R
Rev. 2.00 Sep 20, 2005 page 134 of 800
REJ09B0260-0200
pin is always high. Wait states can be inserted.
Write access
Read access
Basic Bus Control Signal Timing
Figure 6.8 Bus Control Signal Timing for 8-Bit, Three-State-Access Area
Note: n = 7 to 0
Address bus
D
D
D
D
HWR
15
LWR
15
CS
7
7
RD
AS
to D
to D
to D
to D
n
0
0
8
8
High
T
1
15
External address in area n
to D
8
) is used in accesses to these areas. The
Undetermined data
Bus cycle
T
2
Valid
T
Invalid
Valid
3

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