EVB9S12XEP100 Freescale Semiconductor, EVB9S12XEP100 Datasheet - Page 1209

• Manufacturer Part Number: EVB9S12XEP100
• Description: BOARD EVAL FOR MC9S12XEP100
• Manufacturer: Freescale Semiconductor
• Type: MCUr

Specifications of EVB9S12XEP100

• Contents: Module and Misc Hardware
• Processor To Be Evaluated: MC9S12XEP100
• Data Bus Width: 16 bit
• Interface Type: RS-232
• Silicon Manufacturer: Freescale
• Core Architecture: S12
• Core Sub-architecture: S12
• Silicon Core Number: MC9S12
• Silicon Family Name: S12XE
• Rohs Compliant: Yes
• For Use With/related Products: MC9S12XEP100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

A.1.8
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
T
T
P
Θ
The total power dissipation can be calculated from:
P
Two cases with internal voltage regulator enabled and disabled must be considered:
Freescale Semiconductor
J
A
D
INT
JA
P
R
=
D
=
1. Internal voltage regulator disabled
2. Internal voltage regulator enabled
R
=
DSON
P
=
DSON
Junction Temperature, [°C ]
=
Ambient Temperature, [°C ]
=
Total Chip Power Dissipation, [W]
IO
Package Thermal Resistance, [°C/W]
P
P
Chip Internal Power Dissipation, [W]
IO
=
INT
=
is the sum of all output currents on I/O ports associated with V
∑
Power Dissipation and Thermal Characteristics
=
i
+
V
--------------------------------------- for outputs driven high
V
----------- - for outputs driven low
DD35
P
I
R
OL
OL
IO
DSON
I
OH
;
–
V
⋅
OH
I
P
IO i
INT
;
2
=
MC9S12XE-Family Reference Manual Rev. 1.23
P
I
INT
DD
⋅
=
V
DD
I
DDR
T
J
+
=
I
⋅
DDPLL
T
V
A
DDR
+
(
P
⋅
+
D
V
I
•
DDA
DDPLL
Θ
JA
⋅
)
V
DDA
+
I
DDA
⋅
V
DDX
DDA
Appendix A Electrical Characteristics
, whereby
J
) in °C can be
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