MC9S12XEP100MAL Freescale Semiconductor, MC9S12XEP100MAL Datasheet - Page 349

IC MCU 16BIT 1M FLASH 112-LQFP

MC9S12XEP100MAL

Manufacturer Part Number
MC9S12XEP100MAL
Description
IC MCU 16BIT 1M FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XEP100MAL

Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
112-LQFP
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
64 KB
Interface Type
SPI, SSI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Operating Supply Voltage
- 0.3 V to + 6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
For Use With
EVB9S12XEP100 - BOARD EVAL FOR MC9S12XEP100DEMO9S12XEP100 - BOARD DEMO FOR MC9S12XEP100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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0
Chapter 9
Security (S12XE9SECV2)
9.1
This specification describes the function of the security mechanism in the S12XE chip family (9SEC).
9.1.1
The user must be reminded that part of the security must lie with the application code. An extreme example
would be application code that dumps the contents of the internal memory. This would defeat the purpose
of security. At the same time, the user may also wish to put a backdoor in the application program. An
example of this is the user downloads a security key through the SCI, which allows access to a
programming routine that updates parameters stored in another section of the Flash memory.
The security features of the S12XE chip family (in secure mode) are:
Freescale Semiconductor
Revision
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
Number
V02.00
V02.01
V02.02
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
Protect the content of non-volatile memories (Flash, EEPROM)
Execution of NVM commands is restricted
Disable access to internal memory via background debug module (BDM)
Disable access to internal Flash/EEPROM in expanded modes
Disable debugging features for the CPU and XGATE
Introduction
Revision Date
Features
27 Aug 2004
21 Feb 2007
19 Apr 2007
No security feature is absolutely secure. However, Freescale’s strategy is to
make reading or copying the FLASH and/or EEPROM difficult for
unauthorized users.
Sections
Affected
MC9S12XE-Family Reference Manual , Rev. 1.23
Table 9-1. Revision History
- Reviewed and updated for S12XD architecture
- Added S12XE, S12XF and S12XS architectures
- Corrected statement about Backdoor key access via BDM on XE, XF, XS
NOTE
Description of Changes
349

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