MC9S12XEP100MAL Freescale Semiconductor, MC9S12XEP100MAL Datasheet - Page 37

• Manufacturer Part Number: MC9S12XEP100MAL
• Description: IC MCU 16BIT 1M FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XEP100MAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 112-LQFP
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 64 KB
• Interface Type: SPI, SSI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 25
• Operating Supply Voltage: - 0.3 V to + 6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• For Use With: EVB9S12XEP100 - BOARD EVAL FOR MC9S12XEP100DEMO9S12XEP100 - BOARD DEMO FOR MC9S12XEP100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 1-3
of used internal resources in the memory map.
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
1. This value is calculated by the following formula: (64K -2K- XGRAMSIZE)
9S12XEQ512
9S12XEP100
9S12XEP768
9S12XEx384
Internal Resource
9S12XEA128
1. Number of 16K pages addressable via PPAGE register
2. Number of 4K pages addressing the RAM. RAM can also be mapped to 0x4000 - 0x7FFF
3. Number of 1K pages addressing the Cache RAM via the EPAGE register counting downwards from 0xFF
4. Number of 1K pages addressing the Data flash via the EPAGE register starting upwards from 0x00
5. The 384K memory map is split into a 128K block from 0x78_0000 to 0x79_FFFF and a 256K block from
6. The 9S12XEA devices are a special bondout for access to extra ADC channels in 80QFP.
7. The 256K memory map is split into a 128K block from 0x78_0000 to 0x79_FFFF and a 128K block from
8. The 128K memory map is split into a 64K block from 0x78_0000 to 0x78_FFFF and a 64K block from
9S12XEQ512
9S12XEG128
9S12XEP100
9S12XEP768
9S12XET256
9S12XEA256
9S12XEx384
Device
XGATE RAM
0x7C_0000 to 0x7F_FFFF
Available in 80QFP only. WARNING: NOT PIN-COMPATIBLE WITH REST OF FAMILY.
0x7E_0000 to 0x7F_FFFF
0x7F_0000 to 0x7F_FFFF
shows XGATE local address translation to the global memory map. It indicates also the location
FLASH
Device
(6)
6
0x70_0000
FLASH_LOW
0x78_0000
0x78_0000
0x78_0000
0x70_0000
0x74_0000
0x78_0000
B3
—
—
—
Table 1-5. Derivative Dependent Flash Block Mapping
Table 1-4. Derivative Dependent Memory Parameters
Size /KByte
30K
32K
MC9S12XE-Family Reference Manual Rev. 1.23
(1)
(5)
(7)
(8)
0x74_0000
Table 1-3. XGATE Resources
B2
B2
—
—
PPAGE
64
48
32
24
16
(1)
8
0x78_0000
RAM_LOW
0x0F_A000
0x0F_C000
0x0F_D000
0x0F_0000
0x0F_4000
0x0F_8000
B1S
B1S
B1S
B1S
XGFLASH_HIGH = 0x78_8000
XGRAM_LOW = 0x0F_8000
0x7A_0000
RPAGE
B1N
B1N
B1N
16
12
(2)
$Address
—
8
6
4
3
Chapter 1 Device Overview MC9S12XE-Family
0x13_F000
0x13_F000
0x13_F000
0x13_F000
0x13_F000
0x13_F800
EE_LOW
0x7C_0000
B0
B0
B0
B0
4
(3)
EPAGE
4 + 32
4 + 32
4 + 32
4 + 32
2 + 32
0x7E_0000
+ 32
(4)
37