MC9S12XEP100MAL Freescale Semiconductor, MC9S12XEP100MAL Datasheet - Page 843

• Manufacturer Part Number: MC9S12XEP100MAL
• Description: IC MCU 16BIT 1M FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XEP100MAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 112-LQFP
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 64 KB
• Interface Type: SPI, SSI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 25
• Operating Supply Voltage: - 0.3 V to + 6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• For Use With: EVB9S12XEP100 - BOARD EVAL FOR MC9S12XEP100DEMO9S12XEP100 - BOARD DEMO FOR MC9S12XEP100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The Full Partition D-Flash command (see
information register fields where address 0x12_0000 defines the D-Flash partition for user access and
address 0x12_0004 defines the buffer RAM partition for EEE operations.
24.3.2
The Flash module contains a set of 20 control and status registers located between Flash module base +
0x0000 and 0x0013. A summary of the Flash module registers is given in
descriptions in the following subsections.
Freescale Semiconductor
FCCOBIX
FECCRIX
FCLKDIV
Address
& Name
FCNFG
0x0000
0x0001
0x0002
0x0003
0x0004
FSEC
1. Duplicate value used if primary value generates a double bit fault when read during the reset sequence.
0x12_0000 – 0x12_0001
0x12_0002 – 0x12_0003
0x12_0004 – 0x12_0005
0x12_0006 – 0x12_0007
0x12_0008 – 0x12_007F
Global Address
(EEEIFRON)
Register Descriptions
W
W
W
W
W
R
R
R
R
R
Writes to any Flash register must be avoided while a Flash command is
active (CCIF=0) to prevent corruption of Flash register contents and
Memory Controller behavior.
KEYEN1
FDIVLD
CCIE
7
0
0
Table 24-7. EEE Nonvolatile Information Register Fields
KEYEN0
(Bytes)
FDIV6
MC9S12XE-Family Reference Manual , Rev. 1.23
Figure 24-4. FTM128K2 Register Summary
Size
120
6
0
0
0
2
2
2
2
D-Flash User Partition (DFPART)
Refer to
D-Flash User Partition (duplicate
Buffer RAM EEE Partition (ERPART)
Refer to
Buffer RAM EEE Partition (duplicate
Reserved
FDIV5
RNV5
Section
5
0
0
0
Section 24.4.2.14, “Full Partition D-Flash
Section 24.4.2.14, “Full Partition D-Flash
CAUTION
24.4.2.14) is used to program the EEE nonvolatile
IGNSF
FDIV4
RNV4
4
0
0
Chapter 24 128 KByte Flash Module (S12XFTM128K2V1)
FDIV3
RNV3
Description
3
0
0
0
(1)
)
1
)
CCOBIX2
ECCRIX2
Figure 24-4
FDIV2
RNV2
2
0
Command”
Command”
CCOBIX1
ECCRIX1
FDIV1
FDFD
SEC1
with detailed
1
CCOBIX0
ECCRIX0
FDIV0
SEC0
FSFD
0
843