MC9S12XEP100MAL Freescale Semiconductor, MC9S12XEP100MAL Datasheet - Page 62
![IC MCU 16BIT 1M FLASH 112-LQFP](/photos/12/42/124253/mc9s12xep100mal_sml.jpg)
MC9S12XEP100MAL
Manufacturer Part Number
MC9S12XEP100MAL
Description
IC MCU 16BIT 1M FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12XEP768CAL.pdf
(1328 pages)
Specifications of MC9S12XEP100MAL
Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
112-LQFP
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
64 KB
Interface Type
SPI, SSI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Operating Supply Voltage
- 0.3 V to + 6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
For Use With
EVB9S12XEP100 - BOARD EVAL FOR MC9S12XEP100DEMO9S12XEP100 - BOARD DEMO FOR MC9S12XEP100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12XEP100MAL
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12XEP100MAL
Manufacturer:
FREESCALE
Quantity:
20 000
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Chapter 1 Device Overview MC9S12XE-Family
1.2.3
1.2.3.1
EXTAL and XTAL are the crystal driver and external clock pins. On reset all the device clocks are derived
from the EXTAL input frequency. XTAL is the oscillator output.
1.2.3.2
The RESET pin is an active low bidirectional control signal. It acts as an input to initialize the MCU to a
known start-up state. As an output it is driven low to indicate when any internal MCU reset source triggers.
The RESET pin has an internal pull-up device.
1.2.3.3
This input only pin is reserved for test. This pin has a pull-down device.
1.2.3.4
The BKGD/MODC pin is used as a pseudo-open-drain pin for the background debug communication. It
is used as a MCU operating mode select pin during reset. The state of this pin is latched to the MODC bit
at the rising edge of RESET. The BKGD pin has a pull-up device.
1.2.3.5
PAD[15:0] are general-purpose input or output pins and analog inputs AN[15:0] of the analog-to-digital
converter ATD0.
1.2.3.6
PAD[31:16] are general-purpose input or output pins and analog inputs AN[31:16] of the analog-to-digital
converter ATD1.
62
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
Detailed Signal Descriptions
EXTAL, XTAL — Oscillator Pins
RESET — External Reset Pin
TEST — Test Pin
BKGD / MODC — Background Debug and Mode Pin
PAD[15:0] / AN[15:0] — Port AD Input Pins of ATD0
PAD[31:16] / AN[31:16] — Port AD Input Pins of ATD1
The pin list of the largest package version of each MC9S12XE-Family
derivative gives the complete of interface signals that also exist on smaller
package options, although some of them are not bonded out. For devices
assembled in smaller packages all non-bonded out pins should be
configured as outputs after reset in order to avoid current drawn from
floating inputs. Refer to
drawn to Port R, which does not have enabled pull-up/pull-down devices
coming out of reset.
The TEST pin must be tied to V
MC9S12XE-Family Reference Manual , Rev. 1.23
Table 1-10
SS
NOTE
NOTE
in all applications.
for affected pins. Particular attention is
Freescale Semiconductor
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