TMP92xy22FG Toshiba, TMP92xy22FG Datasheet - Page 217

• Manufacturer Part Number: TMP92xy22FG
• Manufacturer: Toshiba

Specifications of TMP92xy22FG

• Package: LQFP100
• Rom Types(m=mask,p=otp, F=flash,e=eeprom): Romless
• Rom Combinations: Romless
• Ram Combinations: 32
• Architecture: 32-bit CISC
• Usb/spi Channels: -
• Uart/sio Channels: 2
• I2c/sio Bus Channels: 1
• (s)dram Controller: -
• Adc 10-bit Channel: 8
• Da Converter: -
• Timer 8-bit Channel: 4
• Timer 16-bit Channel: 2
• Pwm 8-bit Channels: -
• Pwm 16-bit Channels: -
• Cs/wait Controller: 4
• Dual Clock: -
• Number Of I/o Ports: 50
• Power Supply Voltage(v): 3.0 to 3.6

4.
4.1
Electrical Characteristics
Test
parameter
Solderability
Absolute Maximum Ratings
Solderability of lead-free products
Note: The absolute maximum ratings are rated values that must not be exceeded during
Power supply voltage
Input voltage
Output current (1 pin)
Output current (1 pin)
Output current (Total)
Output current (Total)
Power dissipation (Ta = 85°C)
Soldering temperature (10 s)
Storage temperature
Operation temperature
Test condition
(1) Use of Sn-37Pb solder Bath
(2) Use of Sn-3.0Ag-0.5Cu solder bath
operation, even for an instant. Any one of the ratings must not be exceeded. If any
absolute maximum rating is exceeded, the device may break down or its
performance may be degraded, causing it to catch fire or explode resulting in injury
to the user. Thus, when designing products that include this device, ensure that no
absolute maximum rating value will ever be exceeded.
Solder bath temperature =230°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Solder bath temperature =245°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux (use of lead-free)
Parameter
Vcc
VIN
IOL
IOH
ΣIOL
ΣIOH
PD
TSOLDER
TSTG
TOPR
Symbol
92CM22-215
−0.5 to Vcc + 0.5
−0.5 to 4.0
−65 to 150
−40 to 85
Rating
−80
600
260
−2
80
2
Note
Pass:
solderability rate until forming ≥ 95%
Unit
mW
mA
°C
V
TMP92CM22
2007-02-16