LPC1113FHN33/303,5 NXP Semiconductors, LPC1113FHN33/303,5 Datasheet - Page 55

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LPC1113FHN33/303,5

Manufacturer Part Number
LPC1113FHN33/303,5
Description
ARM Microcontrollers - MCU Cortex-M0 24 kB flash up to 8kB SRAM
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1113FHN33/303,5

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1113
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
24 KB
Data Ram Size
4 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 65 C to + 150 C
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Factory Pack Quantity
260
NXP Semiconductors
4.4 Functional description
UM10398
User manual
Table 51.
For details of entering and exiting Deep power-down mode, see
Bit
10
31:11
Symbol
WAKEUPHYS
GPDATA
General purpose register 4 (GPREG4, address 0x4003 8014) bit description
All information provided in this document is subject to legal disclaimers.
Rev. 12 — 24 September 2012
Value
1
0
Chapter 4: LPC111x/LPC11Cxx Power Monitor Unit (PMU)
Description
WAKEUP pin hysteresis enable
Hysteresis for WAKEUP pin enabled.
Hysteresis for WAKUP pin disabled.
Data retained during Deep power-down mode.
Section
UM10398
© NXP B.V. 2012. All rights reserved.
3.9.4.
55 of 538
Reset
value
0x0
0x0

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