XC5VLX50T-1FFG1136C Xilinx Inc, XC5VLX50T-1FFG1136C Datasheet - Page 306

• Manufacturer Part Number: XC5VLX50T-1FFG1136C
• Description: IC FPGA VIRTEX-5 50K 1136FBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-5 LXTr

Specifications of XC5VLX50T-1FFG1136C

• Total Ram Bits: 2211840
• Number Of Logic Elements/cells: 46080
• Number Of Labs/clbs: 3600
• Number Of I /o: 480
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 1136-BBGA, FCBGA
• No. Of Logic Blocks: 7200
• No. Of Gates: 50000
• Family Type: Virtex-5 LXT
• No. Of Speed Grades: 1
• No. Of I/o's: 480
• Clock Management: PLL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: HW-V5-ML561-UNI-G - EVALUATION PLATFORM VIRTEX-5HW-V5-ML550-UNI-G - EVALUATION PLATFORM VIRTEX-5HW-V5-ML521-UNI-G - EVALUATION PLATFORM VIRTEX-5HW-V5GBE-DK-UNI-G - KIT DEV V5 LXT GIGABIT ETHERNET122-1508 - EVALUATION PLATFORM VIRTEX-5
• Number Of Gates: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 122-1564

Chapter 6: SelectIO Resources
306
Nominal PCB Specifications
PCB Construction
Signal Return Current Management
Load Traces
Power Distribution System Design
The nominal SSO table
parameters meet the following requirements.
Note:
SSO Calculator must be used to determine the SSO limit, according to the physical factors of the
unique PCB.
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V
Total board thickness must be no greater than 62 mils (1575 µ).
Traces must be referenced to a plane on an adjacent PCB layer.
The reference plane must be either GND or the V
driver.
The reference layer must remain uninterrupted for its full length from device to
device.
All IOB output buffers must drive controlled impedance traces with characteristic
impedance of 50Ω ± 10%.
Total capacitive loading at the far end of the trace (input capacitance of receiving
device) must be no more than 10 pF.
Designed according to the Virtex-5 FPGA PCB Designer’s Guide.
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CCO
CCO
In cases where PCB parameters do not meet all requirements listed below, the Virtex-5 FPGA
Decoupling capacitors per the device guideline
Approved solder land patterns
and GND vias should have a drill diameter no less than 11 mils (279 µ).
and GND planes cannot be separated by more than 5.0 mils (152 µ)
(Table
www.xilinx.com
6-40) contains SSO limits for cases where the PCB
CCO
associated with the output
Virtex-5 FPGA User Guide
UG190 (v5.3) May 17, 2010