MC68HC711G5 MOTOROLA [Motorola, Inc], MC68HC711G5 Datasheet - Page 168

• Manufacturer Part Number: MC68HC711G5
• Description: High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcontroller
• Manufacturer: MOTOROLA [Motorola, Inc]

The average chip junction temperature, T
equation:
Where:
Note: For most applications P
An approximate relationship between P
Solving equations (1) and (2) for K gives:
Where K is a constant pertaining to the particular part. K can be determined from equation (3) by
measuring P
obtained by solving equations (1) and (2) for any value of T
MOTOROLA
13-2
13.2
13.3
T
P
P
P
JA
A
D
INT
I/O
THERMAL CHARACTERISTICS
POWER CONSIDERATIONS
=
=
=
=
=
D
Thermal Resistance Plastic
(at equilibrium) for known T
Ambient temperature ( o C)
Package thermal resistance, junction-to-ambient ( o C/W)
P
Internal chip power = I
Power dissipation on input and output pins (W) — user determined)
INT
+ P
Characteristic
I/O
I/O
K = P
ELECTRICAL SPECIFICATIONS
P
INT
DD
D
P
D
T
• (T
D
J
J
and can be neglected.
and T J (if P
x V
A
= T
= K
, in degrees Celsius can be obtained from the following
. Using this value of K, the values of P
A
DD
A
+ 273
Symbol
+ (P
(T
(W)
J
JA
o
D
+ 273
C) +
I/O
•
JA
is neglected) is:
o
C)
JA
A
)
.
• P
Value
50
D
2
Unit
C/W
D
and T
MC68HC11G5
J
can be
(1)
(2)
(3)