EP3SE50F780I3N Altera, EP3SE50F780I3N Datasheet - Page 497
EP3SE50F780I3N
Manufacturer Part Number
EP3SE50F780I3N
Description
Stratix III
Manufacturer
Altera
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Conclusion
Referenced
Documents
Altera Corporation
October 2007
External Pin Connections
The Stratix III TSD, located in the top right corner of the die, requires two
pins for voltage reference. When both TSD and analog to digital converter
are used, connect the TEMPDIODEP pin to an external resistor and connect
the TEMPDIODEN pin to ground.
Figure 16–2. TSD Connections
As process geometries get smaller, power and thermal management is
becoming more crucial in FPGA designs. Stratix III offers the
programmable power technology and selectable core voltage options for
low power operation. These features, along with the speed grade choices,
can be used in different permutations to give the best power and
performance combination. Taking advantage of the silicon, the Quartus II
software is able to manipulate designs to use the best combination to
achieve lowest power at the required performance.
For thermal management, the Stratix III temperature sensing diode can
be used with either an external or embedded analog-to-digital converter
in production devices, enabling designers to easily incorporate this
feature in their designs. Being able to monitor the junction temperature of
the device at any time also allows designers to control air flow to the
device and save power for the whole system.
This chapter references the following documents:
■
■
Programmable Power and Temperature Sensing Diode in Stratix III Devices
AN 437: Power Optimization Techniques
DC and Switching Characteristics of Stratix III Devices
Temperature-Sensing
Device
TEMPDIODEP
TEMPDIODEN
Stratix III Device Handbook, Volume 1
Stratix III
16–7
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