DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 130

IC H8S/2552 MCU FLASH 176-LFBGA

DF2552BR26DV

Manufacturer Part Number
DF2552BR26DV
Description
IC H8S/2552 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Datasheets

Specifications of DF2552BR26DV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2552BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 4 Exception Handling
4.7
Figures 4.2 shows the stack state after completion of trap instruction exception handling and
interrupt exception handling.
4.8
When accessing word data or longword data, this LSI assumes that the lowest address bit is 0. The
stack should always be accessed by word transfer instruction or longword transfer instruction, and
the value of the stack pointer (SP: ER7) should always be kept even. Use the following
instructions to save registers:
Use the following instructions to restore registers:
Setting the SP to an odd value may lead to a malfunction. Figure 4.3 shows an example of what
happens when the SP value is odd.
Rev. 6.00 Sep. 24, 2009 Page 82 of 928
REJ09B0099-0600
PUSH.W
PUSH.L
POP.W
POP.L
Stack State after Exception Handling
Usage Note
Figure 4.2 Stack State after Exception Handling (Advanced Mode)
Rn
ERn
Rn
ERn
Note:* Ignored on return.
SP
(a) Interrupt control mode 0
(or MOV.W Rn, @-SP)
(or MOV.L ERn, @-SP)
(or MOV.W @SP+, Rn)
(or MOV.L @SP+, ERn)
(24 bits)
CCR
PC
SP
(b) Interrupt control mode 2
Reserved*
(24 bits)
CCR
EXR
PC

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