DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 944

• Manufacturer Part Number: DF2552BR26DV
• Description: IC H8S/2552 MCU FLASH 176-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2500r

Specifications of DF2552BR26DV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 26MHz
• Connectivity: I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 104
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 24 Electrical Characteristics
Notes: 1. The regular specifications are supported in the H8S/2506 Group only.
Rev. 6.00 Sep. 24, 2009 Page 896 of 928
REJ09B0099-0600
Item
SCI*
A/D
converter
HCAN*
3
2
2. (For H8S/2556 Group) The HCAN input signal is asynchronous, but checked as if it has
3. The P35/SCK1/SCK4 and P34 pins are driven high by NMOS. To output high, the pull-
Input clock cycle Asynchronous t
Input clock pulse width
Input clock rise time
Input clock fall time
Transmit data delay time
Receive data setup time
(synchronous)
Receive data hold time
(synchronous)
Trigger input setup time
Transmit data delay time
Transmit data setup time
Transmit data hold time
been changed at the φ clock rise (two clock intervals) shown in figure 24.24. The HCAN
output signal is asynchronous, but it changes at the φ clock rise (two clock intervals)
shown in figure 24.24.
up resistor should be connected externally.
Synchronous
Symbol Min.
t
t
t
t
t
t
t
t
t
t
Scyc
SCKW
SCKr
SCKf
TXD
RXS
RXH
TRGS
HTXD
HRXS
HRXH
4
6
0.4
⎯
⎯
⎯
38
38
28
⎯
⎯
⎯
Condition A
Max.
⎯
⎯
0.6
1.5
1.5
50
⎯
⎯
⎯
⎯
⎯
⎯
Min.
4
6
0.4
⎯
⎯
⎯
50
50
30
⎯
30
30
Condition B
Max.
⎯
⎯
0.6
1.5
1.5
50
⎯
⎯
⎯
50
⎯
⎯
Unit
t
t
t
ns
ns
ns
ns
ns
ns
ns
cyc
Scyc
cyc
Test
Conditions
Figure 24.21
Figure 24.22
Figure 24.23
Figure 24.24