DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 191

• Manufacturer Part Number: DF2552BR26DV
• Description: IC H8S/2552 MCU FLASH 176-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2500r

Specifications of DF2552BR26DV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 26MHz
• Connectivity: I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 104
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

On-Chip HCAN Module Access Timing (H8S/2556 Group Only):On-chip HCAN module is
accessed in five states. At this time, the data bus width is 16 bits. Figure 7.12 shows on-chip
HCAN module access timing, and figure 7.13 shows the pin states.
φ
Internal address bus
Read
Write
Figure 7.11 Pin States during On-Chip IEB Module Access
HCAN read signal
Internal data bus
HCAN write signal
Internal data bus
φ
Address bus
AS
RD
HWR, LWR
Data bus
Figure 7.12 On-Chip HCAN Module Access Cycle
T
T
1
1
High impedance
T
T
2
2
Bus cycle
Retained
High
High
High
Bus cycle
Address
T
T
Write data
Rev. 6.00 Sep. 24, 2009 Page 143 of 928
3
3
T
T
4
4
Section 7 Bus Controller
Read data
T
5
REJ09B0099-0600