DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 829

IC H8S/2552 MCU FLASH 176-LFBGA

DF2552BR26DV

Manufacturer Part Number
DF2552BR26DV
Description
IC H8S/2552 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Datasheets

Specifications of DF2552BR26DV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2552BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 21.2 Crystal Resonator Characteristics
21.2.2
An external clock signal can be input as shown in the examples in figure 21.4. If the XTAL pin is
left open, ensure that parasitic capacitance does not exceed 10 pF. When an external clock is input
to the EXTAL pin, wait for longer than clock oscillator settling time to keep enough time for PLL
settling before power is supplied or standby mode is canceled.
Frequency (MHz)
R
C
S
0
max (pF)
max (Ω)
External Clock Input
EXTAL
XTAL
8
80
7
Figure 21.4 External Clock Input (Examples)
10
60
7
XTAL pin left open
12
60
7
Open
External clock input
16
50
7
Rev. 6.00 Sep. 24, 2009 Page 781 of 928
Section 21 Clock Pulse Generator
20
40
7
REJ09B0099-0600
25
7
40

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