DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 952

• Manufacturer Part Number: DF2552BR26DV
• Description: IC H8S/2552 MCU FLASH 176-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2500r

Specifications of DF2552BR26DV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 26MHz
• Connectivity: I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 104
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 24 Electrical Characteristics
24.6
Table 24.12 lists the D/A conversion characteristics.
Table 24.12 D/A Conversion Characteristics
Condition A
V
3.3 V ± 0.3 V (BUFGC1 and BUFGC2 in ICPCR are 1),
AV
8 to 26 MHz, T
specifications)
Condition B
V
3.3 V ± 0.3 V (BUFGC1 and BUFGC2 in ICPCR are 1),
AV
8 to 20 MHz, Ta = –40°C to +85°C (wide-range specifications)
Notes: 1. The regular specifications are supported in the H8S/2506 Group only.
Rev. 6.00 Sep. 24, 2009 Page 904 of 928
REJ09B0099-0600
Item
Resolution
Conversion time
Absolute accuracy*
CC
CC
CC
CC
= P1V
= P1V
= 3.0 V to 5.5 V, V
= 3.0 V to 5.5 V, V
2. Except module stop, software standby, and watch modes.
D/A Conversion Characteristics
CC
CC
= P2V
= P2V
a
= –20°C to +75°C (regular specifications)*
(for H8S/2552 Group, H8S/2506 Group):
(for H8S/2556 Group):
CC
CC
2
= 5.0 V ± 0.5 V (BUFGC1 and BUFGC2 in ICPCR are 0)/
= 5.0 V ± 0.5 V (BUFGC1 and BUFGC2 in ICPCR are 0)/
Min.
8
—
—
—
ref
ref
= 3.0 V to AV
= 3.0 V to AV
Typ.
8
—
±2.0
—
Max.
8
10
±3.0
±2.0
CC
CC
, V
, V
SS
SS
= AV
= AV
Unit
bits
µs
LSB
LSB
SS
SS
= 0 V, φ= 32.768 kHz,
= 0 V, φ= 32.768 kHz,
Test Conditions
Load capacitance: 20 pF
Load resistance: 2 MΩ
Load resistance: 4 MΩ
1
, T
a
= –40°C to +85°C (wide-range