DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 28

• Manufacturer Part Number: DF2552BR26DV
• Description: IC H8S/2552 MCU FLASH 176-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2500r

Specifications of DF2552BR26DV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 26MHz
• Connectivity: I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 104
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

22.5 Hardware Standby Mode ................................................................................................... 804
22.6 Module Stop Mode ............................................................................................................ 805
22.7 Watch Mode....................................................................................................................... 806
22.8 φ Clock Output Disabled Function .................................................................................... 807
22.9 Usage Notes ....................................................................................................................... 808
Section 23 List of Registers................................................................................. 811
23.1 Register Addresses (in address order)................................................................................ 812
23.2 Register Bits....................................................................................................................... 832
23.3 Register States in Each Operating Mode ........................................................................... 853
Section 24 Electrical Characteristics ................................................................... 871
24.1 Power Supply Voltage and Operating Frequency Range................................................... 871
24.2 Absolute Maximum Ratings .............................................................................................. 873
24.3 DC Characteristics ............................................................................................................. 874
24.4 AC Characteristics ............................................................................................................. 882
24.5 A/D Conversion Characteristics ........................................................................................ 903
24.6 D/A Conversion Characteristics ........................................................................................ 904
24.7 Flash Memory Characteristics ........................................................................................... 905
Appendix
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Rev. 6.00 Sep. 24, 2009 Page xxvi of xlvi
REJ09B0099-0600
22.4.4 Software Standby Mode Application Example..................................................... 802
22.5.1 Transition to Hardware Standby Mode................................................................. 804
22.5.2 Clearing Hardware Standby Mode........................................................................ 804
22.5.3 Hardware Standby Mode Timing.......................................................................... 804
22.7.1 Transition to Watch Mode .................................................................................... 806
22.7.2 Clearing Watch Mode........................................................................................... 806
22.9.1 I/O Port Status....................................................................................................... 808
22.9.2 Current Consumption during Oscillation Settling Wait Period ............................ 808
22.9.3 DTC Module Stop................................................................................................. 808
22.9.4 On-Chip Peripheral Module Interrupt................................................................... 808
22.9.5 Writing to MSTPCR ............................................................................................. 808
22.9.6 Entering Watch Mode and DTC Module Stop...................................................... 809
24.4.1 Power-On/Off Timing........................................................................................... 882
24.4.2 Clock Timing ........................................................................................................ 884
24.4.3 Control Signal Timing .......................................................................................... 886
24.4.4 Bus Timing ........................................................................................................... 889
24.4.5 Timing of On-Chip Peripheral Modules ............................................................... 895
I/O Port States in Each Pin State........................................................................................ 907
Product Codes .................................................................................................................... 911
......................................................................................................... 907