DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 711

IC H8S/2552 MCU FLASH 176-LFBGA

DF2552BR26DV

Manufacturer Part Number
DF2552BR26DV
Description
IC H8S/2552 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Datasheets

Specifications of DF2552BR26DV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2552BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 19 RAM
Section 19 RAM
This LSI includes high-speed static RAM. The RAM is connected to the CPU by a 16-bit data bus,
enabling one-state access by the CPU to both byte data and word data.
The RAM can be enabled or disabled using the RAME bit in the system control register (SYSCR).
For details on SYSCR, see section 3.2.2, System Control Register (SYSCR).
Rev. 6.00 Sep. 24, 2009 Page 663 of 928
RAM16K1A_000020020300
REJ09B0099-0600

Related parts for DF2552BR26DV