DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 790

IC H8S/2552 MCU FLASH 176-LFBGA

DF2552BR26DV

Manufacturer Part Number
DF2552BR26DV
Description
IC H8S/2552 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Datasheets

Specifications of DF2552BR26DV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2552BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 20 Flash Memory
(2)
The bit rate is calculated by measuring the period of transfer of a low-level byte (H'00) from the
host. The bit rate can be changed by the command for a new bit rate selection. After the bit rate
has been adjusted, the boot program enters the inquiry and selection state. The bit-rate-adjustment
sequence is shown in figure 20.24.
Rev. 6.00 Sep. 24, 2009 Page 742 of 928
REJ09B0099-0600
Bit-Rate-Adjustment State
Programming/erasing
Operations for erasing
user MATs and user
Transition to
programming/erasing
wait
boot MATs
Programming
Operations for
Bit-rate-adjustment
programming
Figure 20.23 Boot Program States
Inquiry/response
state
wait
Reset
inquiry and selection
Erasing
Inquiry
Operations for
Operations for
erasing
Checking
Response
Operations for
Operations for
response
checking

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