DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 819

• Manufacturer Part Number: DF2552BR26DV
• Description: IC H8S/2552 MCU FLASH 176-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2500r

Specifications of DF2552BR26DV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 26MHz
• Connectivity: I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 104
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 20.24 AC Characteristic in Auto-Erase Mode
Conditions: V
Item
Command programming cycle
CE hold time
CE setup time
Data hold time
Data setup time
Programming pulse width
Status polling start time
Status polling access time
Memory erasing time
WE rising time
WE falling time
I/O5 to I/O0
A18 to A0
I/O7
I/O6
WE
OE
CE
CC
= 5.0 V ± 0.5 V, V
t
ces
tf
Figure 20.34 Waveform in Auto-Erase Mode
t
ds
t
wep
H'20
t
tr
ceh
SS
t
dh
= 0 V, T
t
nxtc
Symbol
t
t
t
t
t
t
T
t
t
t
t
nxtc
ceh
ces
dh
ds
wep
spa
erase
r
f
ests
a
= 25°C ± 5°C
H'20
determination signal
determination signal
Erasing normal end
Erasing end
t
ests
Min.
20
0
0
50
50
70
1
⎯
100
⎯
⎯
t
erase
Rev. 6.00 Sep. 24, 2009 Page 771 of 928
t
spa
H'00
Max.
⎯
⎯
⎯
⎯
⎯
⎯
⎯
150
40000
30
30
Section 20 Flash Memory
t
nxtc
REJ09B0099-0600
Unit
μs
ns
ns
ns
ns
ns
ms
ns
ms
ns
ns