DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 715

• Manufacturer Part Number: DF2552BR26DV
• Description: IC H8S/2552 MCU FLASH 176-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2500r

Specifications of DF2552BR26DV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 26MHz
• Connectivity: I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 104
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

20.1.1
Block Diagram
Mode pin
Legend:
FCCS:
FPCS:
FECS:
FKEY:
FMATS: Flash MAT select register
FTDAR: Flash transfer destination address register
RAMER: RAM emulation register
FVACR: Flash vector address control register
FVADR: Flash vector address data register
Note:
To read from or write to the above registers except RAMER, the FLSHE bit in the
system control register 2 (SYSCR2) must be set to 1. When FLSHE is 1, some
TPU control registers (H'FFFE80 to H'FFFEB1) cannot be accessed. The FLSHE
bit should be cleared before the TPU registers are accessed.
Figure 20.1 Block Diagram of Flash Memory
Flash code control status register
Flash program code select register
Flash erase code select register
Flash key code register
FMATS
FTDAR
RAMER
FVACR
FVADR
FCCS
FPCS
FECS
FKEY
Operating
mode
Internal data bus (16 bits)
Control unit
Internal address bus
Flash memory
User MAT: 512 kbytes
(H8S/2556, H8S/2552, H8S/2506)
(H8S/2551, H8S/2505)
User boot MAT: 8 kbytes
Memory MAT unit
Rev. 6.00 Sep. 24, 2009 Page 667 of 928
384 kbytes
Section 20 Flash Memory
REJ09B0099-0600