DF2506BR26DV Renesas Electronics America, DF2506BR26DV Datasheet - Page 719

IC H8S/2506 MCU FLASH 176-LFBGA

DF2506BR26DV

Manufacturer Part Number
DF2506BR26DV
Description
IC H8S/2506 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Datasheets

Specifications of DF2506BR26DV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2506BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
20.1.4
This LSI’s flash memory is configured by the 512-kbyte (H8S/2556, H8S/2552, and H8S/2506) or
384-kbyte (H8S/2551 and H8S/2505) user MAT and 8-kbyte user boot MAT.
The start address is allocated to the same address in the user MAT and user boot MAT. Therefore,
when the program execution or data access is performed between two MATs, the MAT must be
switched by using FMATS register.
The user MAT or user boot MAT can be read in all modes. However, the user boot MAT can be
programmed only in boot mode and programmer mode.
H'000000
H'07FFFF
The size of the user MAT is different from that of the user boot MAT. An address which exceeds
the size of the 8-kbyte user boot MAT should not be accessed. If the attempt is made, data is read
as undefined value.
Address
Flash MAT Configuration
H8S/2556,
H8S/2552,
H8S/2506
512 kbytes
<User MAT>
Figure 20.3 Flash Memory Configuration
H'000000
H'05FFFF
Address
H8S/2551,
H8S/2505
384 kbytes
Rev. 6.00 Sep. 24, 2009 Page 671 of 928
H'000000
H'001FFF
Address
Section 20 Flash Memory
<User Boot MAT>
All products
REJ09B0099-0600
8 kbytes

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