DF2506BR26DV Renesas Electronics America, DF2506BR26DV Datasheet - Page 752

IC H8S/2506 MCU FLASH 176-LFBGA

DF2506BR26DV

Manufacturer Part Number
DF2506BR26DV
Description
IC H8S/2506 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Datasheets

Specifications of DF2506BR26DV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2506BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 20 Flash Memory
(1)
Parts of the procedure program that are made by the user, like download request,
programming/erasing procedure, and determination of the result, must be executed in the on-chip
RAM. The on-chip program that is to be downloaded is all in the on-chip RAM. Note that area in
the on-chip RAM must be controlled so that these parts do not overlap.
Figure 20.10 shows the program area to be downloaded.
Rev. 6.00 Sep. 24, 2009 Page 704 of 928
REJ09B0099-0600
On-Chip RAM Address Map when Programming/Erasing Is Executed
Figure 20.10 RAM Map when Programming/Erasing Is Executed
programming/erasing
processing period
Unusable area in
(Size: 2 kbytes)
downloaded
Area to be
Initialization + programming program
Programming/erasing program entry
Initialization + erasing program
area that can be used by user
area that can be used by user
Initialization program entry
RAM emulation area or
RAM emulation area or
(Return value: 1 byte)
System use area
<On-chip RAM>
(15 bytes)
DPFR
or
RAMTOP (H'FF7000)
FTDAR setting
FTDAR setting + 16
FTDAR setting + 32
FTDAR setting + 2k
RAMEND (H'FFEFBF)
Address

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